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XBP06V4E2HR-G
■ PACKAGING INFORMATION
●
USP-3 Power Dissipation
Power dissipation data for the USP-3 is shown in this page.
The value of power dissipation varies with the mount board conditions.
Please use this data as one of reference data taken in the described
condition.
1. Measurement Condition (Reference data)
Dimensions 40 x 40 mm (1600 mm in one side)
Condition:
Ambient:
Soldering:
Board:
Material:
Thickness:
Through-hole:
Mount on a board
Natural convection
Lead (Pb) free
2
Copper (Cu) traces occupy 50% of the board area
in top and back faces.
Package heat-sink is tied to the copper traces.
Glass Epoxy (FR-4)
1.6 mm
4 x 0.8 Diameter
Evaluation Board (Unit: mm)
2. Power Dissipation vs. Ambient temperature
Board Mount (Tj max = 150 ℃ )
Ambient Temperature ( ℃ )
25
150
Power Dissipation Pd (mW)
1000
0
Thermal Resistance ( ℃ /W)
125.00
vs. Ta
Pd-Ta特性 グラフ
1200
1000
800
600
400
200
0
25
50
75
100
125
150
周 Temperature: ）
Ambient 囲温度Ta（℃ Ta ( ℃ )
3/4
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相关PDF资料
XBP06V4E4GR-G
TVS BIDIR 120MW 6.8V USP-4
XL-1C-50.0000
CRYSTAL 50MHZ SERIES SMD
XM-1-018.432M
CRYSTAL 18.4320MHZ 16PF SMD
XM-4B-018.4320M10/20/-1060/16
CRYSTAL 18.432MHZ 16PF SMD
XR08.48G
800W 48V AC-INPUT RECTIFIER
XRCGB40M000F4M00R0
CRYSTAL HYBRID 40.000MHZ 2016
Y1365V0205QT9U
RES ARRAY MULT OHM 4 RES 8-SSOP
Y1685V0005TT9W
RES NET MULT OHM 2 RES 1505
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